MSI PRO X870E-S EVO WIFI ATX Motherboard ( AMD Socket AM5, Supports AMD Ryzen 9000, 8000, 7000 Series Desktop CPU, 4x DDR5 RAM Slots, Max 256GB RAM )
- EZ PCIe Clip II – The new EZ PCIe Clip II, located on the first slot, features the rebounding force mechanism that allows for easy removal of the graphics card by pressing the tail-like lock with one finger. Due to this exquisite design, users can uninstall the graphics cards effortlessly, even in the cramped case spaces.
- Pre-Installed I/O Shield – The Pre-Installed I/O Shield offers a streamlined and hassle-free installation experience by eliminating the need to manually fit the I/O shield during motherboard setup. With its built-in design, it ensures proper alignment and a secure fit, providing both protection and convenience while enhancing the overall durability of your build.
- EZ CONN DESIGN – The MSI exclusive JAF_1 header allows MPG EZ120 ARGB fan to operate with a single cable. Alternatively, the JAF_1 header can be converted into additional ARGB Gen 1 and fan headers by using a dedicated 1-to-2 EZ Conn-cable, streamlining and optimizing the entire building process.
- 12 DUET RAIL POWER SYSTEM – Unleash and sustain the maximum performance with a flagship VRM design built with a total of 12+2+1 digital power phases. Combining dual power connectors and 60A Smart Power Stage, PRO X870E-S EVO WIFI is ready for the challenge of high-end processors.
- PCB DESIGN – MSI utilizes PCB Fabric Technology to enhance signal performance, resulting in higher bandwidth and faster data transfer while minimizing signal loss. The PCB Fabric Technology also offers better impedance control and improved thermal stability, allowing the boards to endure demanding conditions. Due to the high-quality materials used, MSI motherboards are highly reliable and well-suited for the requirements of modern technology.
- Memory – A huge step of DDR performance enhancement with the latest DDR5 memory. Combines with dedicated SMT welding process and MSI Memory Boost technology, PRO X870E-S EVO WIFI is ready to deliver the world class memory performance.
- HIGH EFFICIENCY MODE – The High-Efficiency Mode is designed to optimize memory performance byincreasing memory bandwidth and reducing latency. With the four sets of RAM timing settings, it allows users to find out the optimal configuration based on the quality of their memory modules.
- LATENCY KILLER – MSI BIOS has introduced the latest Latency Killer feature on all AM5 socket motherboards. Users can enable Latency Killer in the BIOS to reduce memory latency by up to 12% when running at high frequencies. Importantly, it is compatible with a wide range of memory overclocking features, including Memory Try It!!, EXPO, A-XMP, and High-Efficiency Mode, etc.
- PROTECTION – Transient Voltage Suppressors (TVS) are safety devices used to protect against excessive voltage. All motherboard models of MSI are equipped with TVS. When the voltage abnormally rises, the TVS switches from a high-resistance state to a low-resistance state, diverting the excessive voltage to ground. This helps prevent circuit damage caused by high voltage.
- SOLID PIN DESIGN – The 4-pin, 8-pin, and 24-pin power connectors of MSI motherboards are all designed with solid pins. The solid pin design allows for a more stable transmission of 12V power to the CPU, even when handling high current loads.
- STAINLES STEEL IO – An extra layer of sponge materials along with corrosive resistance IO Shield to help improve static electricity and reduce electromagnetic radiation noise from the system as well as much more durable compare to traditional IO Shields.
- Extended Heatsink – Extended Heatsink enlarges the surface of heat dissipation and maintain the performance at heavy loads.
- Heavy Plated VRM Heatsink – The VRM heatsink covers the upper MOS and helps dissipate the heat.
- 2 Shield Frozr – Strengthened M.2 thermal solution helps keep M.2 SSD safe and ensures incredible performance.
- 7W/mK Thermal Pad & Additional Choke Pad – High-quality 7W/mK MOSFET thermal pads and additional choke thermal pads ensure stable performance when all cores are runnging at high speed.
- Enlarged Chipset Heatsink – The enlarged heatsink is designed to reduce dust and noise and capable of maintaining high efficiency of heat dissipation.
| Chipset | AMD X870E |
| CPU | Supports AMD Ryzen 9000/ 8000/ 7000 Series Desktop Processors Socket AM5 |
| Memory | 4x DDR5 UDIMM, Maximum Memory Capacity 256GB Memory Support DDR5 8200 – 5600 (OC) MT/s / 5600 – 4800 (JEDEC) MT/s Ryzen 9000 Series Processors max. overclocking frequency: • 1DPC 1R Max speed up to 8200+ MT/s • 1DPC 2R Max speed up to 6400+ MT/s • 2DPC 1R Max speed up to 6400+ MT/s • 2DPC 2R Max speed up to 6000+ MT/s Supports AMD POR Speed and JEDEC Speed Supports Memory Overclocking and AMD EXPO Supports Dual-Channel mode Supports Non-ECC, Un-buffered memory Supports CUDIMM, Clock Driver bypass mode only* |
| Onboard Graphics | 1x HDMI Support HDMI 2.1 with TMDS port, maximum resolution of 4K 60Hz* 1x Type-C DisplayPort USB4 port, supporting DisplayPort 1.4 with HBR3 over USB Type-C, maximum resolution of 4K 120Hz* *Available only on processors featuring integrated graphics. Graphics specifications may vary depending on the CPU installed. |
| Slot | 2x PCI-E x16 slot (Qty) 1x PCI-E x1 slot (Qty) PCI_E1 Gen PCIe 5.0 supports up to x16 (From CPU) PCI_E2 Gen PCIe 4.0 supports up to x4 (From Chipset) PCI_E3 Gen PCIe 3.0 supports up to x1 (From Chipset) PCI_E1 slot • Supports PCIe 5.0 x16 (For Ryzen 9000/ 7000 Series processors) • Supports PCIe 4.0 x8 (For Ryzen 8700/ 8600/ 8400 Series processors) • Supports PCIe 4.0 x4 (For Ryzen 8500/ 8300 Series processors) |
| Audio | Realtek ALC897 7.1-Channel High Definition Audio |
| Storage | 3x M.2 (Qty) M.2_1 Source (From CPU) supports up to PCIe 5.0 x4 , supports 2280/2260 devices M.2_2 Source (From Chipset) supports up to PCIe 4.0 x4 , supports 22110/2280 devices M.2_3 Source (From Chipset) supports up to PCIe 4.0 x4 , supports 2280/2260 devices 4x SATA 6G (Qty) M2_1 slot • Supports up to PCIe 5.0 x4 (For Ryzen 9000/ 7000 Series processors) • Supports up to PCIe 4.0 x4 (For Ryzen 8000 Series processors) *Please refer to the manual for M.2 SSD heatsink restrictions. |
| RAID | Supports RAID 0 , RAID 1, RAID 5, and RAID 10 for SATA storage devices Supports RAID 0, RAID 1 and RAID 5 for M.2 NVMe storage devices *RAID 5 configuration is only supported by Ryzen 9000/ 7000 series processors. |
| USB | 4x USB 2.0 (Rear) 6x USB 2.0 (Front) 2x USB 5Gbps Type A (Rear) 4x USB 5Gbps Type A (Front) 2x USB 10Gbps Type A (Rear) 1x USB 10Gbps Type C (Front) 1x USB 20Gbps Type C (Rear) 1x USB 40Gbps Type C (Rear) |
| LAN | Realtek 8126VB 5G LAN |
| Internal IO | 1x Power Connector(ATX_PWR) 2x Power Connector(CPU_PWR) 1x Power Connector(PCIE_PWR 8pin) 1x CPU Fan 1x PUMP_SYS Fan 6x System Fan 2x Front Panel (JFP) 1x Chassis Intrusion (JCI) 1x Front Audio (JAUD) 1x Tuning Controller connector(JDASH) 3x Addressable V2 RGB LED connector (JARGB_V2) 1x RGB LED connector(JRGB) 1x TPM pin header(Support TPM 2.0) 6x USB 2.0 ports 4x USB 5Gbps Type A ports 1x USB 10Gbps Type C ports |
| WIRELESS LAN & BLUETOOTH | Wi-Fi 7 The Wireless module is pre-installed in the M.2 (Key-E) slot Supports MU-MIMO TX/RX, 2.4GHz/ 5GHz/ 6GHz* (160MHz) up to 2.9Gbps Supports 802.11 a/ b/ g/ n/ ac/ ax/ be Supports Bluetooth 5.4**, MLO, 4KQAM * 6GHz band support may depend on every country’s regulations and Wi-Fi 7 will be ready in Windows 11 version 24H2. ** The Bluetooth version may be updated, please refer to the Wi-Fi chipset vendor’s website for details. Bluetooth 5.4 will be ready in Windows 11 version 24H2. |
| LED FEATURE | 4x EZ Debug LED 1x EZ Memory Detection LED |
| BACK PANEL PORTS |
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| OPERATING SYSTEM | Support for Windows 11 64-bit |
| PCB Info | ATX 304.8mmx243.84mm |
Zebronics ZEB-H310-NVMe Micro-ATX Motherboard ( Intel LGA 1151 Socket, Supports Intel 6th,7th,8th & 9th Generation Series CPU, 2 DDR4 RAM Slots, Max 32GB RAM )










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