Kingston Server Premier 64GB ( 64GB x 1 ) DDR5 5600MT/s CL46 ECC Registered 2RX4 1.1V 288-pin 16Gbit Hynix A ( KSM56R46BD4-64HA )

Kingston Server Premier 64GB ( 64GB x 1 ) DDR5 5600MT/s CL46 ECC Registered 2RX4 1.1V 288-pin 16Gbit Hynix A ( KSM56R46BD4-64HA )

Kingston’s KSM56R46BD4-64HA is a 8G x 80-bit (64GB) DDR5-5600 CL46 SDRAM (Synchronous DRAM), 2Rx4, ECC, memory module, based on forty 4G x 4-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR5-5600 timing of 46-45-45 at 1.1V. Each 288-pin DIMM uses gold contact fingers.

• Chip Brand and Performance.
  • When Kingston designs a new memory module for a newly released system, Kingston engineers test several brands of chips on the new module design. This testing allows us to determine which brands of chips provide the best performance. Kingston uses a controlled bill of materials for our system-specific module designs to deliver the best performance for your system.
• DDR5 Chip Compatibility.
  • While Kingston tests the chip performance for a specific system, it also tests the chips for compatibility. As memory speeds get faster, chip compatibility becomes increasingly important and varies from system to system, so Kingston tests several different chip brands in each system it supports and has approved vendor lists for its modules.
  • In addition, module physical dimensions affect a module design’s compatibility. In many systems, the number of chips makes a module physically installable and electrically compatible. Designing modules for chip compatibility as well as chip quantity allows us to guarantee absolute compatibility with the system or class of systems in which the module will be installed.
• In-System Testing.
  • Kingston’s engineering process includes the testing of each new module design in the system in which it will ultimately be used. The memory is tested on the system motherboard and with the applications and operating systems most commonly used in the system. This is just one step in the seven-stage pre-production testing process. The in-system testing allows us to ensure that the memory is compatible with all aspects of the system we are designing for including hardware, operating systems and applications.

• Power Supply: VDD = 1.1V Typical
• VDDQ = 1.1V Typical
• VPP = 1.8V Typical
• VDDSPD = 1.8V to 2.0V
• On-Die ECC
• x80 ECC (x40, 2 independent I/O sub channels)
• 32 internal banks
• Hard/Soft Post Package Repair
• Sideband access with I3C/I2C
• PCB: Height 1.23” (31.25mm)
• RoHS Compliant and Halogen-Free